岗位职责：
1).Develop, qualify, optimize Solder Ball Attach (SBA) processes (e.g., ball placement, reflow, flux cleaning…) fadvanced packaging (e.g., BGA, CSP, WLCSP, HBM, HBF…)
2).Investigate new solder materials (e.g., lead-free alloys, low-temperature solders) processes to improve joint reliability thermal performance.
3).Collaborate with material suppliers equipment vendors to evaluate next-generation solutions (e.g., micro-bumping, laser-assisted bonding).
New Process/Product Introduction:
1）.Lead new process setup oversee technical reviews during NPI phases to ensure rapid ramp-up to high-volume production.
2）.Phase review management to ensure new product/process on schedule delivery.
3）.Contribute to advanced packaging roadmaps (e.g., thinner dies, higher die counts, 3D Nintegration, HBM, HBF…).
岗位要求：
教育背景Education
Master’s degree in Electrical Engineering, Material Science, Mechanical Design Engineering, Physics Chemistry Engineering...
知识Knowledge
职位要求的信息或知识范围 :
1.Be familiar with the process flow of Npackaging, including but not limited to the process requirements machine settings of Solder Ball Attach Related.
2.Candidates with semiconductfabrication (Fab) advanced packaging experience are strongly preferred, with demonstrated understanding of key advanced packaging technologies including TSV, TC-NCF, MR-MUF, micro bumping interposer.
相关工作经验Experiences
1. 3+ years of experience in semiconductassembly process/product engineering other related.
2. Experience in new product process technology development is a plus.
3. Good English skill, both writtenal
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