Nisi Semiconductor bm jobs (salary & requirements)

职责描述：
1. New wafer backside process development.
2. Wafer backside process control improvement.
3. Wafer Backside tool maintain repair to ensure smooth mass production
4. Wafer level molding process control development
5. Backside wafer line yield improvement
6. Molding tool SEZ tool maintain to ensure smooth mass production.
7. Training technical to ensure they meet requirement.
8. Any other wafer engineering related project jobs.
任职要求：
a) Education 教育: Bachelabove degree of science/engineering
b) Experience经验: More than 5 years experience in semiconductindustry, preferably to have wafer backside engineering related working experience at wafer fab.
c) Competency Skills能力和技能:
- Analytical, problem solving troubleshooting skills.
- Wafer Backside Process Knowledge
- Fab process knowledge
- Communication Skill
- Project Management