重庆 切割 jobs (salary & requirements)

Type of required functional knowledge (depth, breadth):
 Degree from university higher technical college
Type length of experience required fthe position:
 Process engineering experience in IC-Substrate, HDI-PCB, Assembly, IC-Packaging related industry
Further skills competencies required:
 Knowledge of quality tools like SPC, MSA, DOE, FMEA, CP, etc
 Good analytical skills with attention to details.
 Good stress management skills
 Knowledge of project management, data evaluation design of experiments
 Fluent writtenal English (Mandarin would be of advantage)
 Good team working spirit leadership skills
 Good communication negotiation skills
 Computer skills – MS Office Package (Word, Excel)
Further Responsibilities:
 Experience in working with intercultural teams preferred
 Willingness to travel stay abroad fa certain time in one our locations
 Open minded approach
 Fully understagree our company rule, procedure culture, familiar to your own process knowledge skill then execution in daily work. Not do anything if you don’t understand.
 Understwhom is your internal/external customer also targets do the best to achieve/ ahead the target.
 Continuously improve baseline of all aspects, no matter defined DPI/KPI also self-mindset, skill, knowledge also communication.
 Ownership Accountability is necessary fany cross function topics.
 Understprocess performance justify criteria then doing best to reach the goal. Criticize the rule also fine, but needs have good communication with your superior.
 Before any change activity to have systematic risk identification completion with team due to different function have different consideration fdifferent aspect
 Always fully understbackground expectations also know how to execution before perform the task.
 Fully team alignment based on previous best practices data evidence then asking approval from your superibefore any decision implementation