Samsung product development engineer jobs (salary & requirements)

职责描述：
. 负责新产品在外包厂的认证。
. 根据客户需求定义BOM，产品规范及工艺规范。
. 与foundry及subcon紧密合作，进行工艺改善和项目日程管理。
. 探寻产品改善及成本下降的技术革新方案。
Responsibilities
. Responsible fnew product qualification in subcon.
. Define BOM, product process specification based on customer requirements
. Work closely with foundry subcon in both process improvement project management.
. Research technology innovations in product improvement cost reduction.
任职要求：
. 理工科本科或硕士。
. 3年以上封装经验，有外包管理经验更佳。
. 熟悉半导体封装产品（LF，BGA等）及封装工艺（DA，WB，mold，FC mount，underfill等），有封装设计经验者更佳。
. 熟悉品质和可靠性测试条件及规范。
. 熟悉失效分析方法。
. 熟悉数据分析/处理及DOE方法。
. 善于沟通，英语流利，能承受工作压力，可以出差，良好的团队合作能力。
Qualifications
. Master bachelof engineering.
. Above 3 years in semiconductpackaging. Experience in subcon management is preferred.
.Familiar with semiconductpackage products (LF, BGA etc.) manufacturing process (DA,WB,Mold,etc.). Experience in PKG design is preferred.
. Familiar with quality reliability test conditions specifications.
. Familiar with failure analysis method.
. Familiar with statistics data analysis DOE methods.
. Good communication skills. Fluent writtenal English. Good team player. Ability to work under pressure. Willing to travel.