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Company Overview

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About the Company

深圳市华尚半导体科技有限公司成立于2011年04月15日,主要经营范围为半导体封装设备、高速固晶机、LED封装设备、液晶模组制造设备、集成电路封装设备、太阳能设备、自动化电子生产设备的技术开发、销售及上门维修等。

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Operating Status: 开业
Registered Capital: 1,000万(元)
Legal Representative: 李振江
Date Established:
Credit Code: 914403005731449929
Registered Address: 深圳市宝安区航城街道鹤洲社区鹤洲南片工业区2-3号阳光工业园A1栋二层

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