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About the Company

中芯国际集成电路制造有限公司(“中芯国际”,纽交所代号:SMI,港交所股份代号:981),是*的集成电路晶圆代工企业之一,也是中国内地技术*全面、配套*完善、规模***、跨国经营的集成电路制造企业,提供0.35微米到28纳米不同技术节点的晶圆代工与技术服务。中芯国际总部位于上海,拥有全球化的制造和服务基地。 在上海建有一座300mm晶圆厂和一座200mm晶圆厂;在北京建有一座300mm晶圆厂和一座控股的300mm先进制程晶圆厂;在天津和深圳各建有一座200mm晶圆厂;在江阴有一座控股的300mm凸块加工合资厂;在意大利有一座控股的200mm晶圆厂。中芯国际还在美国、欧洲、日本和中国台湾地区设立行销办事处、提供客户服务,同时在香港设立了代表处。详细资讯请参考中芯国际网站*。


Semiconductor Manufacturing International Corporation (“SMIC”;NYSE: SMI; SEHK: 981), one of the leading foundries in the world, is Mainland China’s largest foundry in scale, broadest in technology coverage, and most comprehensive in semiconductor manufacturing services. SMIC provides integrated circuit (IC) foundry and technology services on process nodes from 0.35 micron to 28 nanometer. Headquartered in Shanghai, China, SMIC has an international manufacturing and service base. In China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm fab in Shanghai; a 300mm fab and a majority-owned 300mm fab for advanced nodes in Beijing; 200mm fabs in Tianjin and Shenzhen; and a majority-owned joint-venture 300mm bumping facility in Jiangyin; additionally, in Italy SMIC has a majority-owned 200mm fab. SMIC also has marketing and customer service offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong. For more information, please visit *.

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Information is aggregated from the web and may not be exact. For reference only.
Information incorrect? Claim this company to edit

How Fast Is Hiring Growing? (1 open positions)

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?
Growth Rate
2026 vs 2025
  • 2025: Up 42%
  • 2024: Down 56%
  • 2023: Up 975%
  • 2022: Down 92%
Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
Campus Recruitment & Advanced Degree Talent Demand
Master's 1
Note: How fast is hiring at 中芯国际集成电路制造(天津)有限公司 growing? 2025年27个(增长42%),2024年19个(下降56%),2023年43个(增长975%),2022年4个(下降92%),2021年51个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

Master's Degree Job Demand Analysis

(More)
?
Growth Rate
2026 vs 2025
  • 2025: Up 143%
  • 2024: Down 13%
Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 中芯国际集成电路制造(天津)有限公司 growing? 历年硕士招聘职位量:2025年17个(增长143%),2024年7个(下降13%),2023年8个.

Doctoral Degree Job Demand Analysis

(More)
N/A
Growth Rate
Doctoral Hiring by Year: 2025 — same as 2024
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is doctoral hiring at 中芯国际集成电路制造(天津)有限公司 growing? 历年博士招聘职位量:2025年1个(增长143%),2024年1个(下降13%),2023年1个.

— What Are the Salaries Like? (19 records)

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salary range: 8K - 20K, 84.2% of roles pay ¥8-15K
Note: salary statistics are based on 19 salary records from the past year and depend on the job sample. For reference only.
中芯国际集成电路制造(天津)有限公司工资待遇怎么样?84.2%的岗位拿8-15K,本科工资¥。与同行业比-23%,其他(研发和技术类)平均工资¥13.3K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

  • 其他(研发和技术类)
    21.1% of total 21.1%
  • 技工类
    21.1% of total 21.1%
  • 机械/仪器仪表类
    21.1% of total 21.1%
  • 电子/电器/通信技术类
    15.8% of total 15.8%

Education

  • 硕士
    52.6% of total 52.6%
  • 本科
    47.4% of total 47.4%

Experience

  • 1-3年
    89.5% of total 89.5%
  • 不限
    10.5% of total 10.5%
View Detailed Analysis

What does 中芯国际集成电路制造(天津)有限公司 require? Who is 中芯国际集成电路制造(天津)有限公司 hiring? 招聘类别其他(研发和技术类)占比最多占21.1%,其次是技工类占21.1%。什么学历能进?硕士占比最多占52.6%,其次是本科占47.4%。学历要求高吗?硕士占52.6%。工作经验有什么要求?1-3年占比最多占89.5%,其次是不限占10.5%。工作地区在哪?天津占比最多占100%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 129,000万(元)
Legal Representative: 刘训峰
Date Established:
Credit Code: 91120111717869977N
Registered Address: 天津市西青经济开发区兴华道19号

Partners & Suppliers

采购光刻胶配套试剂用于晶圆制造 Source
供应商 晶圆制造
采购中巨芯电子湿化学品、电子特种气体等用于集成电路制造 Source
供应商 集成电路晶圆制造
采购去胶、干法刻蚀等设备用于8英寸晶圆厂 Source
供应商 晶圆代工
与中芯天津建立联合实验室或人才培养合作 Source
供应商 高校合作
在中芯天津进行芯片代工生产 Source
合作客户 芯片设计服务

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