Fenmei Packaging R&D strength (tech talent demand and pay)
What is the demand for tech talent at Fenmei Packaging? Based on job postings in the past year, “Other (R&D and Technical)”占14.5%,“Computer/Network/Technology”占13%,“Biology/Pharmaceutical/Chemical/Environmental Protection”占5.8%,“Electronics/Electrical/Communication Technology”占4.3%. For reference only.