About the Company

芯迪半导体科技(上海)有限公司是一家立足于中国发展的集成电路芯片设计公司。于2010年在美国硅谷成立。其核心团队均来自美国硅谷*的通信集成电路芯片设计公司,并同时拥有在中国、亚洲及北美市场营销的丰富经验。目前公司主要重点是通过发展下一代高智能集成电路芯片产品,为家庭网络的合理化建设、多通道高清互动电视/家庭物联网/家庭智能电网的实现、家庭的智能化管理以及对家庭现有网络的低成本改造提供*佳的解决方案。芯迪的*款芯片产品采用了适用于下一代家庭网络及家庭智能电网的国际标准ITU-T G.hn。与目前国际市场上小规模推出的MoCA、HPNA、HomePlugAVIEEE P190)技术相比, G.hn具有速率高、互通性好、兼容家庭各种物理介质(电力线,电缆,电话线)的特点。随着包括中国电信在内的全球一流电信运营商的大力支持及推动,G.hn已经被认为是*为理想的家庭组网技术。在中国,随着城市光网的普及,G.hn将会走入千家万户、并带动中国智慧城市,智能家庭的迅速发展。

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Financing History (1 rounds)

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Latest Financing Round
  • Date: ?
  • Amount: 数百万美元
  • Investor: 遨问投资

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Operating Status: 开业
Registered Capital: 618万(美元)
Legal Representative: 牛玉清
Date Established:
Credit Code: 91310115563133624G
Registered Address: 中国(上海)自由贸易试验区蔡伦路1690号2幢113室

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