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Company Overview

About the Company

公司主营生产
—半导体塑封模具
—自动化系统(DML、AFL、DTFS、Automold)
—精冲模具及零件电镀
—注塑模具及注塑件
—电镀(Sn)半导体封装产品

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Business Registration

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Operating Status: 开业
Registered Capital: 1,700万(元)
Legal Representative: 韩曜光
Date Established:
Credit Code: 9131000060727506XT
Registered Address: 上海市闵行区申南路215号3幢C101室

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