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Company Overview

Development Stage

About the Company

深圳市福英达工业技术有限公司是一家*的微电子与半导体封装材料方案提供商,国家高新技术企业、深圳市专精特新企业、国家小巨人企业。自1997年以来,深耕于微电子与半导体封装材料行业。拥有从合金焊粉到应用产品的完整产品线,是目前全球*可制造T2-T10全尺寸超微合金焊粉的电子级封装材料制造商。公司锡膏、锡胶及合金焊粉等产品广泛应用于微电子与半导体封装的各个领域。得到全球SMT电子化学品制造商、微光电制造商和半导体封装测试商的普遍认可。

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Information is aggregated from the web and may not be exact. For reference only.
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How Fast Is Hiring Growing? (5 open positions)

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Note: How fast is hiring at 深圳市福英达工业技术有限公司 growing? 2025: 14 openings (up 100%), 2024: 7 openings (up 600%), 2023: 1 openings (flat), 2022: 1 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

— What Are the Salaries Like? (10 records)

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salary range: 6K - 30K, 90% of roles pay ¥6-15K
Note: salary statistics are based on 10 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 深圳市福英达工业技术有限公司?90% of positions earn 6-15K, Undergraduate salary: ¥。技工类 average salary ¥12.5K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

honors, qualifications & industry associations

Job Category

  • 技工类
    30% of total 30%
  • 销售类
    30% of total 30%
  • 生物/制药/化工/环保类
    20% of total 20%
  • 其他(研发和技术类)
    10% of total 10%

Education

  • 大专
    40% of total 40%
  • 高中
    20% of total 20%
  • 本科
    20% of total 20%
  • 硕士
    10% of total 10%

Experience

  • 1-3年
    50% of total 50%
  • 3-5年
    40% of total 40%
  • 5-10年
    10% of total 10%
View Detailed Analysis

What does 深圳市福英达工业技术有限公司 require? Who is 深圳市福英达工业技术有限公司 hiring? recruitment: 技工类占比最多占30%,其次是销售类占30%. What education can get in at ? 大专占比最多占40%,其次是高中占20%. High education required at ? 硕士占10%. Work experience required at ? 1-3年占比最多占50%,其次是3-5年占40%. Where are the job locations at ? 深圳占比最多占100%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 1,300万(元)
Legal Representative: 王勤
Date Established:
Credit Code: 9144030027935995XW
Registered Address: 深圳市宝安区松岗街道潭头社区西部工业区A39栋101

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