池州华钛半导体有限公司(NationT),应运中国电子信息产业的高速发展需要,立足中国半导体产业链,专注半导体后工序大规模集成电路测试封装高端制造业。年封装测试能力:10亿只集成电路块。封装形式包括:DIP系列、SOP系列、TSSOP系列、SSOP系列、SOT系列、TO系列、QFP系列、QFN系列等。主要工艺包括:晶圆受入检查,晶圆减薄,晶圆切割,芯片安放(固晶),银浆固化,引线键合(打线),塑封,烘烤,电镀(镀纯锡),激光打标,切筋打弯,外观检查,成品测试,包装出..等 点击查看...
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