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About the Company

[Summary] 无线通讯产品及嵌入式软件开发商

慧翰微电子股份有限公司是一家致力于为智能网联汽车及产业物联网设计和开发“高可靠性、高性价比”无线通讯产品、嵌入式软件和系统解决方案的高新技术企业。
公司总部位于福建福州,在上海、厦门设有研发中心,深圳设有办事处,是国内通过欧盟e-Call认证的智能网联汽车核心部件供应商。
市场覆盖全球20多个国家。合作伙伴包括上汽吉利奇瑞、大众、丰田、通用等国内外一线整车厂及宁德时代德赛西威、电装、弗吉亚、Microchip等全球行业龙头企业。

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Information is aggregated from the web and may not be exact. For reference only.
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慧翰股份 Financing History (4 rounds)

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IPO上市
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Market: 创业板
  • Deal: 深交所

慧翰股份 How Fast Is Hiring Growing? (22 open positions)

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?
Growth Rate
2026 vs 2025
  • 2025: Up 34%
  • 2024: Up 44%
  • 2023: Up 39%
  • 2022: Flat 0%-
慧翰股份 Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
慧翰股份 Campus Recruitment & Advanced Degree Talent Demand
Master's 1
Note: How fast is hiring at 慧翰微电子股份有限公司 growing? 慧翰股份2025年187个(增长34%),2024年140个(增长44%),2023年97个(增长39%),2022年70个(持平),2021年70个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

慧翰股份 Master's Degree Job Demand Analysis

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?
Growth Rate
2026 vs 2025
  • 2025: Down 38%
  • 2024: Down 20%
慧翰股份 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 慧翰微电子股份有限公司 growing? 慧翰股份历年硕士招聘职位量:2025年5个(下降38%),2024年8个(下降20%),2023年10个.

慧翰股份 Doctoral Degree Job Demand Analysis

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N/A
Growth Rate
慧翰股份 Doctoral Hiring by Year: 2025
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is doctoral hiring at 慧翰微电子股份有限公司 growing? 慧翰股份历年博士招聘职位量:2025年2个(下降38%),2023年4个.

慧翰股份 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 慧翰微电子股份有限公司? Based on an analysis of 慧翰股份's job postings over the past year, “计算机/网络/技术类”需求占44.9%,“电子/电器/通信技术类”占36.7%,“其他(研发和技术类)”占12.9%,“机械/仪器仪表类”占8.8%,“生物/制药/化工/环保类”占0.7%,“美术/设计/创意类”占0.7%. For reference only.

慧翰股份 — What Are the Salaries Like? (147 records)

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慧翰股份 Salary Overview
salary range: 2K - 50K, 66.7% of roles pay ¥10-20K
Note: salary statistics are based on 147 salary records from the past year and depend on the job sample. For reference only.
慧翰微电子股份有限公司工资待遇怎么样?慧翰股份66.7%的岗位拿10-20K,本科工资¥。福州地区工资排名前30%,与同行业比+22%,计算机/网络/技术类平均工资¥17.4K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 慧翰股份

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Are salaries high at 慧翰微电子股份有限公司? We provide: 嵌入式,软件工程,质量,qe,ux,销售,硬件,项目经理,信息,mcu,开发工程师,系统工程师,安全,测试工程,认证工程师,软件开发,射频工程师,技术总监,layout,pi. Click to view detailed salary analysis by job.

慧翰股份 honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

慧翰股份 Related Industry Tags

Job Category

  • 计算机/网络/技术类
    44.9% of total 44.9%
  • 电子/电器/通信技术类
    36.7% of total 36.7%
  • 质量管理类
    22.4% of total 22.4%
  • 其他(研发和技术类)
    12.9% of total 12.9%

Education

  • 本科
    89.8% of total 89.8%
  • 大专
    7.5% of total 7.5%
  • 硕士
    2% of total 2%
  • 初中
    0.7% of total 0.7%

Experience

  • 3-5年
    40.1% of total 40.1%
  • 不限
    23.8% of total 23.8%
  • 1-3年
    20.4% of total 20.4%
  • 5-10年
    15.6% of total 15.6%
View Detailed Analysis

What does 慧翰微电子股份有限公司 require? Who is 慧翰股份 hiring? 慧翰股份招聘类别计算机/网络/技术类占比最多占44.9%,其次是电子/电器/通信技术类占36.7%。慧翰股份什么学历能进?本科占比最多占89.8%,其次是大专占7.5%。慧翰股份学历要求高吗?硕士占2%。工作经验慧翰股份有什么要求?3-5年占比最多占40.1%,其次是不限占23.8%。慧翰股份工作地区在哪?福州占比最多占57.1%,其次是芜湖占17%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 10,452.35万(元)
Legal Representative: 隋榕华
Date Established:
Credit Code: 91350000676537158E
Registered Address: 福建省福州市马尾区江滨东大道116号1#楼5楼

Partners & Suppliers

为公司车联网及物联网产品提供国际认证服务(如欧盟e/E-mark认证等) Source
供应商 检测认证
公司物联网智能模组客户,采购公司模组用于网络通讯设备 Source
合作客户 物联网终端厂商
公司物联网智能模组客户,采购公司模组用于支付终端产品 Source
合作客户 物联网终端厂商
公司物联网智能模组客户,采购公司模组用于移动支付终端(POS机) Source
合作客户 物联网终端厂商
向公司供应存储芯片(如DRAM、NAND Flash),用于公司车载及物联网产品 Source
供应商 存储芯片

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工程施工 桥梁工程 隧道工程 路面工程
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