福联集成 oc jobs (salary & requirements)

福联集成 oc salary range: 15K - 50K, where 100% of positions earn ¥15-50K
福联集成 oc salary range: 15K-50K, the most positions earn 15-20K, based on 2 related positions in the past year, as of 2026-10-09
¥15-50K
100% of positions earn

Note: the average salary is analyzed based on job postings published by the company. We recommend reviewing it together with position type, education, region and experience.

福联集成 oc salary changes over the years

Note: the data depends on salary samples of online job postings in the corresponding years and does not fully represent the actual situation within the company. For reference only.

Education requirements: 本科 is the most common

What education does 福联集成 require for oc positions? 本科占比最多,占100%

Salary by education

福联集成 oc salaries by education: 本科 ¥28.8K.

福联集成 oc hiring regions: mainly 莆田

In which cities does 福联集成 have offices for oc positions? The main distribution is as follows: 莆田 accounts for 100%. Click this module to view the proportions of other cities, based on job postings in the past year. For reference only.

福联集成 oc hiring trends over the years

福联集成 oc changes in hiring volume over the years

What does 福联集成 oc do

Based on related job postings of 福联集成 in the past year
  • 光电晶圆工艺经理(Process Manager)

    莆田-涵江区 | 5-10年 | 本科以上 | 2026-10-02
    20-50k
    1. 全面负责激光芯片/GaAs/InP 光电晶圆制造工艺体系搭建,主导光刻、刻蚀、薄膜、腔面处理、镀膜等核心制程开发与量产落地。
    2. 制定工艺路线、工艺规范、控制计划及良率提升方案,独立推进新工艺导入与项目攻关。
    3. 带领工艺团队解决制程异常、失效分析、批次波动问题,确保项目按期交付。
    4. 对接研发、器件、设备、测试团队,统筹工艺方案评审、风险评估及跨部门协同。
    5. 搭建工艺团队,培养骨干,完善SOP、培训体系及工艺管理流程。
    任职要求
    1. 光电、微电子、材料、物理等相关专业,本科及以上学历。
    2. 5-10年及以上半导体晶圆工艺经验,有化合物半导体/激光芯片工艺经验优先。
    3. 具备独立负责产线或新项目工艺搭建能力,能带团队、能扛指标。
    4. 熟悉DOE、良率改善、失效分析逻辑,具备较强项目推进与跨部门协调能力。
    5. 结果导向,抗压能力强,能独立推动新项目从0到1落地。
    More
  • 工艺资深工程师(Process SeniEngineer)

    莆田-涵江区 | 不限经验 | 本科以上 | 2026-10-02
    10-20k 򀀩

莆田 oc salary

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How much does 莆田 oc pay? 10-15K is the most common