Company Overview

Development Stage

  • Ranking: Ranked #4 in Putian by popularity
  • Honors: 高新技术企业 省级专精特新中小企业 According to algorithm
  • Salary: 55.4% of positions earn 10-30K, In 2026 vs last yeargrew by 67%.。Master's salary: ¥20.5K.
  • R&D: "电子/电器/通信技术类" demand: 19.6%, "其他(研发和技术类)": 12.5%, "机械/仪器仪表类": 10.7%。
  • Recruiting: In 2026 vs 2025decreased by 52%. Demand for highly educated talent: Master's: 2.
  • Requirement: Education: 本科 leads with 71.4%. Experience: 不限 leads with 53.6%.
  • Region: Distributed across 1 regions, 莆田: 98.2%, 福州: 1.8%.

About the Company

[Summary] 第二代与第三代半导体芯片制造的晶圆专工服务

福建省福联集成电路有限公司2015年10月成立于福建省莆田市,公司注册资本4亿元,是福建省电子信息集团控股的专注于化合物半导体晶圆代工服务的国有控股企业。
福联集成规划总投资30亿元,建设一座年产12万片化合物半导体晶圆代工厂。公司目前已建成一条具备量产能力的6英寸砷化镓射频芯片生产线,可为客户提供高性能射频、微波、毫米波芯片的制程服务。
福联集成拥有稳定的制程能力、丰富制造服务经验、先进的工艺技术及完备的研发能力并不断提升制程能力,聚焦GaAs HBT/pHEMT 等高性能射频微波工艺的自主研发和产业化。
福联集成作为福建省电子信息制造业“增芯强屏”战略部署的重要环节,先后被纳入“中国科学院STS区域重点项目” “福建省重点建设项目”等国家、省部级专项项目,并获批建设福建省射频与功率芯片制造工程研究中心。
福联集成一直坚决贯彻落实国资委、集团党委各项决策部署,坚持党建,以改革促发展,致力成为化合物半体晶圆代工服务的公司,与客户携手共赢,实现射频芯片国产化目标。

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Information is aggregated from the web and may not be exact. For reference only.
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福联集成 How Fast Is Hiring Growing? (13 open positions)

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Note: How fast is hiring at 福建省福联集成电路有限公司 growing? 福联集成2025: 54 openings (up 29%), 2024: 42 openings (down 21%), 2023: 53 openings (up 71%), 2022: 31 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

福联集成 Master's Degree Job Demand Analysis

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N/A
Growth Rate
福联集成 Master's Hiring by Year: 2026
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 福建省福联集成电路有限公司 growing? 福联集成Master's recruitment over the years: 2026: 5 openings (down 52%), 2024: 3 openings (down 21%), 2023: 3 openings (up 71%), 2022: 2 openings.

福联集成 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 福建省福联集成电路有限公司? Based on an analysis of 福联集成's job postings over the past year, "电子/电器/通信技术类" demand: 19.6%, "其他(研发和技术类)": 12.5%, "机械/仪器仪表类": 10.7%, "生物/制药/化工/环保类": 10.7%, "电气/能源/动力类": 5.4%, "计算机/网络/技术类": 5.4%. For reference only.

福联集成 — What Are the Salaries Like? (56 records)

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福联集成 Salary Overview
salary range: 4.5K - 50K, 55.4% of roles pay ¥10-30K
Note: salary statistics are based on 56 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 福建省福联集成电路有限公司?福联集成55.4% of positions earn 10-30K, Undergraduate salary: ¥。Putian salary ranking top 5,技工类 average salary ¥21.6K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 福联集成

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Are salaries high at 福建省福联集成电路有限公司? We provide: 设备工,工艺工程,ma,厂务,工艺经理,整合工程师,oc,pr,制程工程师,建模,模工,环境专员,环安主管,生产管理,申报专员,研发工程师,设计工程师,部长,采购,量测工程师. Click to view detailed salary analysis by job.

福联集成 honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

福联集成 Related Industry Tags

Job Category

  • 技工类
    26.8% of total 26.8%
  • 工厂生产类
    23.2% of total 23.2%
  • 电子/电器/通信技术类
    19.6% of total 19.6%
  • 经营管理类
    16.1% of total 16.1%

Education

  • 本科
    71.4% of total 71.4%
  • 不限
    17.9% of total 17.9%
  • 硕士
    8.9% of total 8.9%
  • 大专
    1.8% of total 1.8%

Experience

  • 不限
    53.6% of total 53.6%
  • 5-10年
    32.1% of total 32.1%
  • 1-3年
    7.1% of total 7.1%
  • 3-5年
    7.1% of total 7.1%
View Detailed Analysis

What does 福建省福联集成电路有限公司 require? Who is 福联集成 hiring? 福联集成 recruitment: 技工类占比最多占26.8%,其次是工厂生产类占23.2%. What education can get in at 福联集成? 本科占比最多占71.4%,其次是不限占17.9%. High education required at 福联集成? 硕士占8.9%. Work experience required at 福联集成? 不限占比最多占53.6%,其次是5-10年占32.1%. Where are the job locations at 福联集成? 莆田占比最多占98.2%,其次是福州占1.8%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 101,618.5399万(元)
Legal Representative: 林喆
Date Established:
Credit Code: 91350303MA2XN4WB03
Registered Address: 莆田市涵江区江口镇赤港涵新路3688号

Partners & Suppliers

与福联集成共建化合物半导体联合实验室,开展技术研发与人才培养合作 Source
供应商 高校/研究院合作

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