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About the Company

本公司成立1998年,主要生产电路板半成品,产品主要进口于欧美国家。

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Recruitment Overview / Current Status (3 open positions)

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Note: How fast is hiring at 臣田骏普科技(深圳)有限公司 growing? . A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

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Business Registration

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Operating Status: 开业
Registered Capital: 1,280万(香港元)
Legal Representative: 李永森
Date Established:
Credit Code: 914403000539629166
Registered Address: 深圳市宝安区西乡臣田宝田工业区28栋

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