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About the Company

浙江红果微电子有限公司是一家专业从事半导体集成电路后道封装、测试、销售和服务的高新技术企业,属国家产业政策重点支持行业。
公司占地面积三十余亩,厂房面积三万多平米。拥有净化等级一万级的超净厂房2500多平方米,具备完整的水、电、气动力配套系统。主要生产设备购自国际*IC设备制造厂家。
产品封装形式以DIP、SDIP、MSOP、SOP、SOT、TO-92/94等为主,现具有月封装一亿只集成电路的生产规模,并将在此基础上继续增加投入,开发更具市场潜力的高端产品,逐步使公司的月封装能力达到二至四亿只集成电路的生产规模。

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Operating Status: 开业
Registered Capital: 3,500万(元)
Legal Representative: 田剑彪
Date Established:
Credit Code: 91330602670253912E
Registered Address: 浙江省绍兴市阳明北路685号

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