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Company Overview

Development Stage

About the Company

[Summary] 牛年新环境,新设备!

   广东金田半导体科技有限公司创立于2011年9月,拥有净化厂房4000平方米,专业从事半导体晶体管的高新技术企业,集研发、生产、销售为一体,产品远销国内外市场。公司采用先进的半导体全自动化生产设备及检测设备,严谨规范化管理,获得ISO9001:2015质量管理体系认证,产品通过欧盟ROHS各项指标认证。

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Information is aggregated from the web and may not be exact. For reference only.
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How Fast Is Hiring Growing? (7 open positions)

Manage
?
Growth Rate
2026 vs 2025
  • 2025: Up 71%
  • 2024: Up 21%
  • 2023: Down 18%
  • 2022: Up 1600%
Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
Campus Recruitment & Advanced Degree Talent Demand
Interns 1
Note: How fast is hiring at 广东金田半导体科技有限公司 growing? 2025年29个(增长71%),2024年17个(增长21%),2023年14个(下降18%),2022年17个(增长1600%),2021年1个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

— What Are the Salaries Like? (36 records)

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salary range: 3K - 8K, 83.3% of roles pay ¥3-6K
Note: salary statistics are based on 36 salary records from the past year and depend on the job sample. For reference only.
广东金田半导体科技有限公司工资待遇怎么样?83.3%的岗位拿3-6K,与同行业比-29%,工厂生产类平均工资¥5.3K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

(More)
Are salaries high at 广东金田半导体科技有限公司? We provide: qc,会计,出纳,实习技术员,实习生,工人,操作员,机台操作,班长,设备技术,质检,车间. Click to view detailed salary analysis by job.

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Job Category

  • 工厂生产类
    41.7% of total 41.7%
  • 技工类
    25% of total 25%
  • 在校学生类
    16.7% of total 16.7%
  • 财务/审计/统计类
    16.7% of total 16.7%

Education

  • 高中
    58.3% of total 58.3%
  • 初中
    16.7% of total 16.7%
  • 大专
    16.7% of total 16.7%
  • 不限
    8.3% of total 8.3%

Experience

  • 不限
    58.3% of total 58.3%
  • 1-3年
    41.7% of total 41.7%
View Detailed Analysis

What does 广东金田半导体科技有限公司 require? Who is 广东金田半导体科技有限公司 hiring? 招聘类别工厂生产类占比最多占41.7%,其次是技工类占25%。什么学历能进?高中占比最多占58.3%,其次是初中占16.7%。工作经验有什么要求?不限占比最多占58.3%,其次是1-3年占41.7%。工作地区在哪?汕头占比最多占100%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 1,400万(元)
Legal Representative: 林德辉
Date Established:
Credit Code: 914405005829421524
Registered Address: 汕头市新溪镇金新路金源工业区(汕头市北斗技术开发有限公司第二层及附楼一、二、三、四、五层)

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