苏州汉骅半导体有限公司 Reviews, Salaries and Jobs

Company Overview

Nature: 合资 Size: 50-99人 Founded: 9年
Industry: 电子技术/半导体/集成电路、通信/电信/网络设备
Full name: 苏州汉骅半导体有限公司。

Development Stage

Stage: B轮, 数亿人民币。
Ranking: Ranked #9 in 苏州导体材料公司 by popularity Ranked #9 in 苏州半导体材料研发公司 by popularity Ranked #9 in 苏州宽禁带半导体公司 by popularity Ranked #16 in 苏州5G公司 by popularity
Honors: 专精特新小巨人企业独角兽企业 According to algorithm
Salary: 48.1% of positions earn 8-15K, In 2026 vs last yeargrew by 5%.。.
Recruiting: In 2026 vs 2025decreased by 52%.
Requirement: Education: 本科 leads with 77.8%. Experience: 不限 leads with 44.4%.
Region: Distributed across 1 regions, 苏州: 96.3%, 深圳: 3.7%.

About the Company

苏州汉骅半导体有限公司成立于2017年11月13日，位于苏州工业园区长阳街259号钟园工业坊B0-1F，属于国家扶持的战略新兴产业，技术团队为来自海内外高端专业人才，致力于第三代半导体关键材料的研发与生产，主要产品应用于高端5G通讯芯片，驱动第五代移动通讯各项应用。公司树立“创新、开放、合作、共赢”为核心的经营理念，以科技创新为本，工商并重，为高端5G通讯芯片产业链内上下游企业提供高科技、全方位的解决方案。

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Information is aggregated from the web and may not be exact. For reference only.

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Financing History (1 rounds)

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B轮

Capital Market Favor

Latest Financing Round

Date: ?
Amount: 数亿人民币
Investor: 弘晖资本，苏州冠亚，望睿投...

How Fast Is Hiring Growing? (13 open positions)

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Growth Rate

2026 vs 2025

2025: Up 3%
2024: Up 7%
2023: Up 114%
2022: Down 55%

Year-by-Year Hiring:

2021 31 jobs 2022 14 jobs 2023 30 jobs 2024 32 jobs 2025 33 jobs 2026 ? *** 

* Hiring was generally low during 2020-2022 due to the pandemic

Suzhou 12 Shenzhen 1

Latest Jobs

Note: How fast is hiring at 苏州汉骅半导体有限公司 growing? 2025: 33 openings (up 3%), 2024: 32 openings (up 7%), 2023: 30 openings (up 114%), 2022: 14 openings (down 55%), 2021: 31 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

Master's Degree Job Demand Analysis

(More)

N/A

Growth Rate

Master's Hiring by Year: 2024 — same as 2023

2023 1 jobs 2024 1 jobs

* Hiring was generally low during 2020-2022 due to the pandemic

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Master's Salary 򀀩

How fast is master's hiring at 苏州汉骅半导体有限公司 growing? Master's recruitment over the years: 2024: 1 openings (up 7%), 2023: 1 openings (up 114%).

— What Are the Salaries Like? (27 records)

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Salary Overview

￥8-15K

48.1% of roles pay

salary range: 4.5K - 50K, 48.1% of roles pay ￥8-15K

3.7% 4.5-6K 14.8% 6-8K ***  ? 8-10K ***  ? 10-15K 18.5% 15-20K 7.4% 20-30K 7.4% 30-50K

Note: salary statistics are based on 27 salary records from the past year and depend on the job sample. For reference only.

Salary Ranking

By Category

技工类￥17.8K  工厂生产类  质量管理类  客户服务类  机械/仪器仪表类 

How is the salary at 苏州汉骅半导体有限公司?48.1% of positions earn 8-15K, Undergraduate salary: ¥。技工类 average salary ¥17.8K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at 苏州汉骅半导体有限公司? We provide: 工艺工程，质量，controller，专利工程师，信息，助理工程，控制经理，施工，财务，销售，oc，前台，操作工，普工，法务，行政，设备工，采购，风控助理. Click to view detailed salary analysis by job.

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

技工类
25.9% of total 25.9%
工厂生产类
22.2% of total 22.2%
质量管理类
18.5% of total 18.5%
客户服务类
14.8% of total 14.8%

Job Location

Education

本科
77.8% of total 77.8%
大专
14.8% of total 14.8%
高中
7.4% of total 7.4%

Experience

不限
44.4% of total 44.4%
3-5年
37% of total 37%
1-3年
11.1% of total 11.1%
5-10年
7.4% of total 7.4%

View Detailed Analysis

What does 苏州汉骅半导体有限公司 require? Who is 苏州汉骅半导体有限公司 hiring? recruitment: 技工类占比最多占25.9%，其次是工厂生产类占22.2%. What education can get in at ? 本科占比最多占77.8%，其次是大专占14.8%. Work experience required at ? 不限占比最多占44.4%，其次是3-5年占37%. Where are the job locations at ? 苏州占比最多占96.3%，其次是深圳占3.7%. Based on job postings from the past year, for reference only.