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中芯芯片科技(南京)股份有限公司位于南京六合经济开发区,注册资金1000万美元。
公司联合创始人包括美国国家工程院院士、存储器及单极CMOS芯片、模拟混合信号芯片设计专家,他们均拥有超过30年以上半导体行业经验,获得多项设计大奖以及发表过多篇国际论文,并且已取得多项发明专利

核心技术团队来自美国硅谷国际知名芯片设计公司,拥有多年芯片设计经验及成功案例。

南京中芯芯片公司专注于模拟/混合信号芯片及传感器芯片设计。公司产品应用在手机、平板、笔记本电脑、可穿戴、智能硬件设备、智能家居及白色家电等领域。

2018年公司在申请专利、获得专利技术授权、集成电路布图登记保护方面积极布局。公司同时规划人工智能及物联网领域的芯片研发。

作为无晶圆厂的芯片设计公司,我们的产品生产全部委托国际知名厂商加工,供应商主要为TSMC、VIS、CSMC、ASE、长电科技等国际国内知名厂商。确保一流的产品质量。

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Operating Status: 开业
Registered Capital: 1,000万(美元)
Legal Representative: 潘世升
Date Established:
Credit Code: 91320100MA1UX3W32J
Registered Address: 南京市江北新区研创园江淼路88号腾飞大厦B座11楼

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