Wuhan Hongxin

Wuhan Hongxin Semiconductor Manufacturing Co., Ltd. (HSMC) was established in November 2017, with its headquarters located in the Airport Economic and Technological Development Zone, Dongxihu District, Wuhan City, China. The company has assembled a top-tier expert team from the global semiconductor wafer R&D and manufacturing field, possessing extensive experience in 14nm and sub-7nm node FinFET advanced logic processes and wafer-level advanced packaging technologies. With a spirit of independent research and development, adhering to the philosophy of serving the country with "chips" and realizing the Chinese dream, the company is based in Wuhan, radiating across the country, and looking to the world. Aiming at the goal of highly self-owned advanced wafer and packaging manufacturing technologies in the integrated circuit industry, it is building an advanced "integrated system" production line for domestic semiconductor logic processes and wafer-level packaging for China's increasingly powerful electronics and chip design industries, paired with a strong intellectual property IP design team. With an innovative business model, it helps to facilitate the application and comprehensive popularization of China's world-leading 5G and AI technologies in mobile terminals, high-speed computing, IoT devices, automotive electronics, and other technological fields.



The total investment of the Wuhan Hongxin project is approximately USD 20 billion. The main investment projects are:

1. A 14nm logic process production line is expected to be built, with a total capacity of 30,000 wafers per month.

2. A sub-7nm logic process production line is expected to be built, with a total capacity of 30,000 wafers per month.

3. A wafer-level advanced packaging production line is expected to be built.