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Development Stage

About the Company

浙江和睿半导体科技有限公司是一家专业
从事半导体集成电路封装测试的企业,公司成
立于2017年,注册资金7000万元,目前总投资
1.5亿元。江苏和睿半导体科技有限公司成立
2017年,注册资金7000万元。
公司拥有SOP.SOT.DIP.TO.DFN等系列封装
形式,广泛引进和吸收了众多国内外知名品牌
的生产和管理经验,采用了先进的ERP管理系
统,拥有日本、美国、中国台湾、中国香港等国家及地
区的先进的封装设备和技术,成立了独立的可
靠性实验分析室,已成功申请实用新型和外观
设计等多项国家专利,为制造高品质的产品提
供了硬件和软件的保证。

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Operating Status: 开业
Registered Capital: 7,000万(元)
Legal Representative: 郑石磊
Date Established:
Credit Code: 91330382MA29A4LR9L
Registered Address: 浙江省温州市乐清市柳市镇柳乐路387-389号(浙江东和半导体科技有限公司内)

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