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About the Company

[Summary] 提供简洁易用和高性能射频前端解决方案

芯朴科技致力于高性能高品质射频前端芯片模组研发,产品广泛应用于手机、物联网模块、智能终端等多个领域组成的海量市场。

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芯朴科技 Financing History (5 rounds)

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A+轮
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 近亿人民币
  • Investor: 创东方投资,鑫元基金,诺铁...

芯朴科技 Recruitment Overview / Current Status (1 open positions)

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Note: How fast is hiring at 芯朴科技(上海)有限公司 growing? . A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

芯朴科技 honors, qualifications & industry associations

芯朴科技 Related Industry Tags

Business Registration

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Operating Status: 开业
Registered Capital: 2,286.4117万(元)
Legal Representative: 顾建忠
Date Established:
Credit Code: 91310115MA1K4873XG
Registered Address: 中国(上海)自由贸易试验区郭守敬路498号8幢19号楼3层

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