苏州凡络新材料科技有限公司注册于2018年8月，注册资本2857万元，现有面积760平方米，公司拥有多名国内外知名半导体材料专家团队，致力于半导体分装类的特种胶黏剂材料、特种结构胶黏剂、声学产品的研发及产业化。主要应用于芯片组装、硅晶元加工等智能电子元部件的组装、固定、声学组件的拼接，公司本身具备多种体系胶黏剂配方技术（包括丙烯酸系、环氧系、聚氨酯系、有机硅系和复合型体系）、高分子合成技术（各种分子量的预聚体），为实现打破核心材料的国外垄断，重点材料国产化而不懈努力。
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