合肥 技术开发 jobs (salary & requirements)

合肥沛顿存储科技有限公司 技术开发 salary range: 10K - 30K, where 100% of positions earn ¥10-30K
合肥沛顿存储科技有限公司 技术开发 salary range: 10K-30K, the most positions earn 10-15K, based on 3 related positions in the past year, as of 2026-10-07
¥10-30K
100% of positions earn

Note: the average salary is analyzed based on job postings published by the company. We recommend reviewing it together with position type, education, region and experience.

合肥沛顿存储科技有限公司 技术开发 salary changes over the years

Note: the data depends on salary samples of online job postings in the corresponding years and does not fully represent the actual situation within the company. For reference only.

Education requirements: 本科 is the most common

What education does 合肥沛顿存储科技有限公司 require for 技术开发 positions? 本科占比最多,占100%

Salary by education

合肥沛顿存储科技有限公司 技术开发 salaries by education: 本科 ¥16.7K.

技术开发 hiring regions: mainly 合肥

In which cities does 合肥沛顿存储科技有限公司 have offices for 技术开发 positions? The main distribution is as follows: 合肥 accounts for 100%. Click this module to view the proportions of other cities, based on job postings in the past year. For reference only.

技术开发 hiring trends over the years

技术开发 changes in hiring volume over the years

合肥 技术开发 related job postings

Based on related job postings of 合肥沛顿存储科技有限公司 in the past year
  • 封装技术开发工程师

    合肥-蜀山区 | 不限经验 | 本科以上 | 2026-09-20
    1-1.5万
    岗位职责:
    1、对接研发部门项目的客户,为研发部门的项目客户端对接窗口,结合客户的需求,制定出项目的计划给到内部,对研发项目客户满意度负责;
    2、负责立项和制定研发项目管理与计划;
    3、领导、组织、沟通和协调关联研发部门项目的实施和推进项目导入项目完成;
    4、根据客户需求组织内部产品、制程验证并整理汇总验证结果;
    5、组织并参与新项目的评估并汇总输出前期的项目立项必要性报告。
    岗位要求:
    1、熟悉封装工艺流程,熟悉项目导入流程;
    2、熟悉FBGA、WBGA、WLCSP、FCCSP、FCBGA等封装工艺及其工艺制程;
    3、熟悉封装相关的国际标准,如JEDEC、MIL、AECQ者优先;
    4、熟悉ISO9001,IATF 16949体系标准,掌握 PPAP、APQP工具。了解QCP、FMEA、MSA和SPC;
    5、了解半导体器件的失效模式,失效分析;
    6、具有良好的沟通能力和协调能力;有封测的研发&项目管理的经验;
    7、英语四级,良好的英语说写能力。
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  • 封装技术开发高级工程师

    合肥-蜀山区 | 不限经验 | 本科以上 | 2026-09-20
    2-3万 򀀩

合肥 技术开发 salary

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How much does 合肥 技术开发 pay? 10-15K is the most common