Company Overview

Development Stage

About the Company

深圳市卓兴半导体科技有限公司由*的运动控制专家团队创立,并汇聚了业内一流的封装技术专家,积淀 20 年深厚技术底蕴与市场落地经验,专注于高精密半导体贴装装备研发、生产制造及销售的专精特新“小巨人”、国家高新技术企业。 公司以新型显示、光通讯器件及 PLP 板级封装设备为核心业务,同步搭建覆盖功率器件封装、智能化控制设备及封装制程管理系统的完整产品矩阵。主营产品包括半导体高精度贴装设备、Clip工艺封装设备、MiniLED COB晶片转移设备、智能化控制设备及半导体封装制程管理系统等。产品拥有完全的自主知识产权并构成了知识产权族群。致力于为全球客户提供一站式、高性能、高可靠性的先进封装解决方案。

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Products & Services (1 in total)

7.0, 1万 downloads
踏路科技官方提供的体感车交互软件。 本APP功能包括:速度、里程、喇叭控制、温度查看等;可以手动、陀螺仪遥控;可以跟三五好友地图互动,可以抓拍朋友的特技动作,可以升级体感车固...
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How Fast Is Hiring Growing? (6 open positions)

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Growth Rate
2026 vs 2025
  • 2025: Down 29%
  • 2024: Down 3%
  • 2023: Up 93%
  • 2022: Down 38%
Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
Note: How fast is hiring at 深圳市卓兴半导体科技有限公司 growing? 2025: 20 openings (down 29%), 2024: 28 openings (down 3%), 2023: 29 openings (up 93%), 2022: 15 openings (down 38%), 2021: 24 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

Master's Degree Job Demand Analysis

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N/A
Growth Rate
Master's Hiring by Year: 2024 — 2 fewer jobs than 2023
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 深圳市卓兴半导体科技有限公司 growing? Master's recruitment over the years: 2024: 1 openings (down 3%), 2023: 3 openings (up 93%).

— What Are the Salaries Like? (18 records)

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salary range: 4.5K - 50K, 66.7% of roles pay ¥6-10K
Note: salary statistics are based on 18 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 深圳市卓兴半导体科技有限公司?66.7% of positions earn 6-10K, Undergraduate salary: ¥。客户服务类 average salary ¥7.1K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

honors, qualifications & industry associations

Related Industry Tags

Job Category

  • 客户服务类
    33.3% of total 33.3%
  • 其他(研发和技术类)
    27.8% of total 27.8%
  • 技工类
    22.2% of total 22.2%
  • 机械/仪器仪表类
    16.7% of total 16.7%

Education

  • 大专
    55.6% of total 55.6%
  • 本科
    22.2% of total 22.2%
  • 高中
    16.7% of total 16.7%
  • 不限
    5.6% of total 5.6%

Experience

  • 不限
    83.3% of total 83.3%
  • 1-3年
    16.7% of total 16.7%
View Detailed Analysis

What does 深圳市卓兴半导体科技有限公司 require? Who is 深圳市卓兴半导体科技有限公司 hiring? recruitment: 客户服务类占比最多占33.3%,其次是其他(研发和技术类)占27.8%. What education can get in at ? 大专占比最多占55.6%,其次是本科占22.2%. Work experience required at ? 不限占比最多占83.3%,其次是1-3年占16.7%. Where are the job locations at ? 深圳占比最多占94.4%,其次是北京占5.6%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 5,000万(元)
Legal Representative: 曾逸
Date Established:
Credit Code: 91440300359597712N
Registered Address: 深圳市宝安区福海街道展城社区福园二路西丰成工业园厂房三栋501

Partners & Suppliers

卓兴半导体采购其视觉检测系统用于设备 Source
供应商 半导体封测
卓兴半导体向其提供LED封装固晶设备 Source
合作客户 半导体封测
卓兴半导体向其提供固晶机等封装设备 Source
合作客户 半导体封测

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