深圳市卓兴半导体科技有限公司由*的运动控制专家团队创立,并汇聚了业内一流的封装技术专家,积淀 20 年深厚技术底蕴与市场落地经验,专注于高精密半导体贴装装备研发、生产制造及销售的专精特新“小巨人”、国家高新技术企业。 公司以新型显示、光通讯器件及 PLP 板级封装设备为核心业务,同步搭建覆盖功率器件封装、智能化控制设备及封装制程管理系统的完整产品矩阵。主营产品包括半导体高精度贴装设备、Clip工艺封装设备、MiniLED COB晶片转移设备、智能化控制设备及半导体封装制程管理系统等。产品拥有完全的自主知识产权并构成了知识产权族群。致力于为全球客户提供一站式、高性能、高可靠性的先进封装解决方案。
What does 深圳市卓兴半导体科技有限公司 require? Who is 深圳市卓兴半导体科技有限公司 hiring? recruitment: 客户服务类占比最多占33.3%,其次是其他(研发和技术类)占27.8%. What education can get in at ? 大专占比最多占55.6%,其次是本科占22.2%. Work experience required at ? 不限占比最多占83.3%,其次是1-3年占16.7%. Where are the job locations at ? 深圳占比最多占94.4%,其次是北京占5.6%. Based on job postings from the past year, for reference only.
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