桂林芯翼半导体科技有限公司坐落于“山水甲天下”的广西桂林,专业从事先进集成电路封装,为客户提供从封装预研/封装设计到批量生产的一站式集成电路封测服务,封装形式涵盖QFN/DFN, BGA/LGA/SiP,Open Molding(开窗封装)。
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