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Company Overview

Development Stage

About the Company

桂林芯翼半导体科技有限公司坐落于“山水甲天下”的广西桂林,专业从事先进集成电路封装,为客户提供从封装预研/封装设计到批量生产的一站式集成电路封测服务,封装形式涵盖QFN/DFN, BGA/LGA/SiP,Open Molding(开窗封装)。

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Recruitment Overview / Current Status (1 open positions)

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Note: How fast is hiring at 桂林芯翼半导体科技有限公司 growing? . A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

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Business Registration

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Operating Status: 开业
Registered Capital: 500万(元)
Legal Representative: 王希有
Date Established:
Credit Code: 91450323MA5Q9JYC5T
Registered Address: 桂林市七星区六合路 123号桂林电子科技大学科技园3号楼3205-3206室

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Competitors (Similar Companies)

“创造品质生活”
“物联网技术的研发者和无线通信模组的供应商”
连接器 光通信 光纤连接器 光开关
集成电路设计 人工智能 位置服务 集成电路
饮料 化妆品 快速消费品 实业投资
智能制造 装备自动化 非标自动化 智能设备

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