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About the Company

江西全道半导体有限公司位于江西崇仁高新技术园区。全道科技有限公司成立于2019年10月,是福建仁豪集团全资子公司。本项目总投资¥3亿元,下设三家子公司、标准式工厂3栋(占地面积6000多平方,厂房建筑面积18000多平方米)和综合办公楼1栋(占地面积650平方,建筑面积2600平方)、预计用工超250人。
*期项目建设周期6年,6年累计产值100亿元、税收2亿元。*期项目建设完,将形成集成电路IC芯片封测16条生产线、LED光源封装50条生产流水线、键合金丝12条生产线等,年产量集成电路IC芯片10000KK、LED光源芯片10000KK、键合金丝2.88t。集成电路IC芯片主要设备有磨片机、划片机、固晶机、厌氧烤箱、焊线机、塑封机、冲筋成型机、打标机、测试分选机等;LED光源主要设备有固晶机、焊线机、分光机、编带机、点胶机、搅拌机、烤箱、扩晶机、真空包装机等;键合金丝主要设备有熔炼炉、拉丝机、退火装置复绕机、真空包装机等。
公司本着“诚信、创新、高效、优质”的原则,积极实施产品“品牌化”、“专业化”战略,以规范的企业管理,雄厚的技术力量,强大的生产制造能力,为客户提供优质的产品和专业的售后服务。

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Operating Status: 开业
Registered Capital: 10,000万(元)
Legal Representative: 许桂林
Date Established:
Credit Code: 91361024MA38Y9LY1W
Registered Address: 江西省抚州市崇仁县高新技术园区产业大道9号

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