[Summary] 无线通信连接芯片及平台整体解决方案
芯迈微半导体(Cmind-SEMI)成立于2021年,公司总部位于珠海横琴,在中国上海、杭州、西安和美国尔湾(Irvine)等地设有产品研发中心。团队来自国内和国际著名通信公司,核心人员均具有15年以上蜂窝通信芯片研发和产品经验。公司成立之初即得到著名投资机构和强大产业背景资本的青睐和支持。
公司专注于提供5G和4G先进无线通信芯片及平台整体解决方案。产品规划涵盖物联网(IoT)、车联网(C-V2X/T-BOX)和智能手机(Smart Phone),致力于赋能千行百业,促进社会数字化、智能化转型升级,助力构建智能、安全、高效的智慧出行和万物互联的社会。成为智(AI)连(5G)万物通信芯片佼佼者。
What does 芯迈微半导体(上海)有限公司 require? Who is 芯迈微 hiring? 芯迈微 recruitment: 电子/电器/通信技术类占比最多占83.3%,其次是计算机/网络/技术类占75%. What education can get in at 芯迈微? 本科占比最多占66.7%,其次是硕士占33.3%. High education required at 芯迈微? 硕士占33.3%. Work experience required at 芯迈微? 3-5年占比最多占41.7%,其次是不限占25%. Where are the job locations at 芯迈微? 上海占比最多占83.3%,其次是杭州占8.3%. Based on job postings from the past year, for reference only.
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