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About the Company

Information is aggregated from the web and may not be exact. For reference only.
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How Fast Is Hiring Growing? (6 open positions)

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Note: How fast is hiring at 江苏希尔芯半导体设备有限公司 growing? 2025年17个(增长42%),2024年12个(增长20%),2023年10个(增长100%),2022年5个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

— What Are the Salaries Like? (23 records)

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salary range: 3K - 15K, 82.6% of roles pay ¥6-10K
Note: salary statistics are based on 23 salary records from the past year and depend on the job sample. For reference only.
江苏希尔芯半导体设备有限公司工资待遇怎么样?82.6%的岗位拿6-10K,本科工资¥。与同行业比-43%,机械/仪器仪表类平均工资¥7.8K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at 江苏希尔芯半导体设备有限公司? We provide: 财务,cnc,装配,出纳,售后,学徒,操机,机械设计,电控,设计工程师,设计师助理,cad,nc技术员,plc,业务助理,业务员,保安,厨师,技工,文员. Click to view detailed salary analysis by job.

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Related Industry Tags

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Job Category

  • 机械/仪器仪表类
    34.8% of total 34.8%
  • 技工类
    30.4% of total 30.4%
  • 客户服务类
    21.7% of total 21.7%
  • 计算机/网络/技术类
    17.4% of total 17.4%

Education

  • 大专
    60.9% of total 60.9%
  • 高中
    21.7% of total 21.7%
  • 初中
    8.7% of total 8.7%
  • 本科
    8.7% of total 8.7%

Experience

  • 不限
    73.9% of total 73.9%
  • 1-3年
    13% of total 13%
  • 5-10年
    8.7% of total 8.7%
  • 3-5年
    4.3% of total 4.3%
View Detailed Analysis

What does 江苏希尔芯半导体设备有限公司 require? Who is 江苏希尔芯半导体设备有限公司 hiring? 招聘类别机械/仪器仪表类占比最多占34.8%,其次是技工类占30.4%。什么学历能进?大专占比最多占60.9%,其次是高中占21.7%。工作经验有什么要求?不限占比最多占73.9%,其次是1-3年占13%。工作地区在哪?南通占比最多占100%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 5,600万(元)
Legal Representative: 周平
Date Established:
Credit Code: 91320612MA207FXQ21
Registered Address: 南通高新区金川路东、油榨路北

Partners & Suppliers

江苏希尔芯向华天科技提供封装设备 Source
合作客户 半导体封装测试设备
江苏希尔芯向通富微电提供封装设备 Source
合作客户 半导体封装测试设备
江苏希尔芯向长电科技提供半导体封装设备 Source
合作客户 半导体封装测试设备

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