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Company Overview

Development Stage

About the Company

南通德聚半导体材料有限公司成立于2022年8月24日,位于开发区新兴东路1号久钰金谷产业园,由东莞市德聚胶接技术有限公司全额投资,公司致力于半导体材料、特种胶膜的研发、销售,着眼全球市场,注重技术研发、科技创新,引进国内外先进的半导体研发等设备,以解决半导体核心材料卡脖子技术难题。

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How Fast Is Hiring Growing? (15 open positions)

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Note: How fast is hiring at 南通德聚半导体材料有限公司 growing? 2025年42个(增长180%),2024年15个,2022年3个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

— What Are the Salaries Like? (43 records)

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salary range: 4.5K - 50K, 76.8% of roles pay ¥4.5-8K
Note: salary statistics are based on 43 salary records from the past year and depend on the job sample. For reference only.
南通德聚半导体材料有限公司工资待遇怎么样?76.8%的岗位拿4.5-8K,本科工资¥。与同行业比-19%,质量管理类平均工资¥5.9K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

(More)
Are salaries high at 南通德聚半导体材料有限公司? We provide: 实验员,操作工,仓管,检验,测试专员,研发工程师,质检,质量,ehs,生产技术,运维,采购,销售助理,仓库,库管. Click to view detailed salary analysis by job.

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

  • 质量管理类
    37.2% of total 37.2%
  • 工厂生产类
    30.2% of total 30.2%
  • 其他(研发和技术类)
    18.6% of total 18.6%
  • 贸易/物流/采购/运输类
    16.3% of total 16.3%

Education

  • 大专
    67.4% of total 67.4%
  • 本科
    18.6% of total 18.6%
  • 高中
    14% of total 14%

Experience

  • 不限
    100% of total 100%
View Detailed Analysis

What does 南通德聚半导体材料有限公司 require? Who is 南通德聚半导体材料有限公司 hiring? 招聘类别质量管理类占比最多占37.2%,其次是工厂生产类占30.2%。什么学历能进?大专占比最多占67.4%,其次是本科占18.6%。工作经验有什么要求?不限占比最多占100%。工作地区在哪?南通占比最多占100%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 1,125万(元)
Legal Representative: 黄成生
Date Established:
Credit Code: 91320691MABUR7J52B
Registered Address: 江苏省南通市开发区新兴东路1号9#

Partners & Suppliers

南通德聚向通富微电供应半导体封装用膜材料 Source
合作客户 半导体封装测试
南通德聚向华天科技供应半导体封装用胶带等材料 Source
合作客户 半导体封装测试
南通德聚向长电科技供应半导体封装用胶带等材料 Source
合作客户 半导体封装测试

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