惠州金亿信精密科技(Genison)为硕贝德控股旗下子公司,前身为惠州金迪精密部品,因集团业务重组而股改成立。
公司专注于微精密结构件的研发和制造,精工于新能源电池、5G小基站、智能家居、医疗器械、汽车、手机等领域精密结构件的冲压拉伸、模内注塑、冷锻、压铸、CNC加工以及多工艺复合制造,努力成长为中国智造的核心精密件方案提供者和制造商。
What does 惠州金亿信精密科技有限公司 require? Who is 惠州金亿信精密科技有限公司 hiring? recruitment: 技工类占比最多占47.8%,其次是工厂生产类占34.8%. What education can get in at ? 不限占比最多占82.6%,其次是高中占8.7%. Work experience required at ? 1-3年占比最多占56.5%,其次是3-5年占21.7%. Where are the job locations at ? 惠州占比最多占100%. Based on job postings from the past year, for reference only.
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