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About the Company

晶旺半导体(山东)有限公司于2021年1月在潍坊市滨海经济技术开发区集成电路产业园注册成立,注册资本金1亿元人民币。一期计划投资1亿元,规划晶圆Bumping加工产能48,000片/月;二期项目计划投资5-9亿元,建设半导体高端制造产业园,扩充晶圆Bumping生产产能至15万片/月,建设晶圆测试生产线,建设基于晶圆Bumping技术支撑的晶圆封装生产线及晶圆Bumping全产业应用产线。

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Recruitment Overview / Current Status (1 open positions)

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Operating Status: 开业
Registered Capital: 10,000万(元)
Legal Representative: 闾邱祁刚
Date Established:
Credit Code: 91370700MA3URE3123
Registered Address: 山东省潍坊市滨海区集成电路产业园S5栋一层

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