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Business Registration

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Operating Status: 开业
Registered Capital: 2,500万(元)
Legal Representative: 方春林
Date Established:
Credit Code: 91361181MA39UB4MX0
Registered Address: 江西省上饶市德兴市德兴高新技术产业园区香屯生态工业园

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Partners & Suppliers

合肥长鑫采用联仕的CMP抛光垫用于DRAM制造 Source
合作客户 存储芯片
青岛芯恩采购联仕CMP抛光垫用于芯片制造 Source
合作客户 逻辑芯片
长江存储采购联仕CMP抛光垫用于3D NAND闪存生产 Source
合作客户 存储芯片
上海华力采用联仕的CMP抛光垫进行晶圆加工 Source
合作客户 晶圆代工
华虹半导体采购联仕CMP抛光垫用于逻辑芯片制造 Source
合作客户 晶圆代工

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