瀚思瑞Hexcera 2023年3月成立于南通海门,注册资本1亿元。
致力于成为*的功率半导体陶瓷覆铜板供应商,为客户提供从材料、制造、封装、测试的完整解决方案。
产品涉及多类型、高可靠DCB、AMB陶瓷覆铜板。
瀚思瑞Hexcera核心团队由业内经验丰富的研发、技术、生产、品质及销售人员组成,拥有10年以上DCB、AMB产品设计、工艺开发、制造及检验经验。
瀚思瑞Hexcera采用美国、日本及国内先进的陶瓷覆铜基板生产、检测设备,确保高品质产品交付。整套DCB、AMB覆铜板表面处理生产线,可为客户提供镀镍、镀金、镀银等不同表面的陶瓷覆铜板。
25年年初完成二期工厂扩建项目,进一步释放产能。
What does 江苏瀚思瑞半导体科技有限公司 require? Who is 江苏瀚思瑞半导体科技有限公司 hiring? recruitment: 工厂生产类占比最多占32.9%,其次是经营管理类占21.4%. What education can get in at ? 本科占比最多占67.1%,其次是大专占31.4%. Work experience required at ? 5-10年占比最多占32.9%,其次是1-3年占28.6%. Where are the job locations at ? 南通占比最多占100%. Based on job postings from the past year, for reference only.
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