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About the Company

辰至半导体成立于2023年,主要从事ASIL-D级(较高车规安全等级)车规芯片的研发设计,拥有一支成建制的车规大芯片团队,公司研发人员多来自哲库、恩智浦、Marvell等知名大厂,具备多款高门槛车规芯片、手机芯片的全流程设计经验和量产案例。

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辰至半导体 Financing History (2 rounds)

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Latest Financing Round
  • Date: ?
  • Amount: 融资金额未公开
  • Investor: 郭彦超

辰至半导体 honors, qualifications & industry associations

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辰至半导体 Related Industry Tags

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Business Registration

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Operating Status: 开业
Registered Capital: 537.8547万(元)
Legal Representative: 刘叶
Date Established:
Credit Code: 91110111MACDRL7G0T
Registered Address: 北京市东城区朝阳门北大街8号5-7富华大厦A座7层701

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