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Development Stage

About the Company

Information is aggregated from the web and may not be exact. For reference only.
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How Fast Is Hiring Growing? (8 open positions)

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Note: How fast is hiring at 江苏容导半导体科技有限公司 growing? 2025年24个(下降40%),2024年40个(增长90%),2023年21个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

— What Are the Salaries Like? (31 records)

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salary range: 4.5K - 50K, 51.6% of roles pay ¥4.5-8K
Note: salary statistics are based on 31 salary records from the past year and depend on the job sample. For reference only.
江苏容导半导体科技有限公司工资待遇怎么样?51.6%的岗位拿4.5-8K,本科工资¥。与同行业比-35%,技工类平均工资¥7.9K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

(More)
Are salaries high at 江苏容导半导体科技有限公司? We provide: 操作工,检测,设计工程师,pm,出纳,工艺工程,抛光,氩弧焊,焊工,生产经理,生产计划,质量,会计,化学,压力容器设计,学工,数控,文员,普车,机加工. Click to view detailed salary analysis by job.

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

  • 技工类
    48.4% of total 48.4%
  • 工厂生产类
    19.4% of total 19.4%
  • 质量管理类
    16.1% of total 16.1%
  • 财务/审计/统计类
    12.9% of total 12.9%

Education

  • 大专
    41.9% of total 41.9%
  • 高中
    32.3% of total 32.3%
  • 本科
    25.8% of total 25.8%

Experience

  • 不限
    80.6% of total 80.6%
  • 1-3年
    12.9% of total 12.9%
  • 3-5年
    6.5% of total 6.5%
View Detailed Analysis

What does 江苏容导半导体科技有限公司 require? Who is 江苏容导半导体科技有限公司 hiring? 招聘类别技工类占比最多占48.4%,其次是工厂生产类占19.4%。什么学历能进?大专占比最多占41.9%,其次是高中占32.3%。工作经验有什么要求?不限占比最多占80.6%,其次是1-3年占12.9%。工作地区在哪?无锡占比最多占100%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 7,973.4947万(元)
Legal Representative: 董兴玉
Date Established:
Credit Code: 91320214MAC4LCY81J
Registered Address: 无锡市新吴区鸿山街道鸿昌路11号

Partners & Suppliers

为江苏容导半导体提供EDA工具授权 Source
供应商 EDA软件
采购江苏容导半导体的MCU产品 Source
合作客户 芯片设计/IP
为江苏容导半导体提供芯片封装测试服务 Source
供应商 芯片封测

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