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Company Overview

About the Company

成立时间:2023年7月 核心技术团队:拥有15年以上经验的资深行业专家依托上市公司精测电子(股票代码300567.SZ)平台,研发、生产及销售半导体用碳化硅(SiC)材料及备件。公司坐落于苏州工业园区综合保税区拥有7000平米研发及生产基地,以更好的服务半导体行业客户。

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Recruitment Overview / Current Status (5 open positions)

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Note: How fast is hiring at 苏州精材半导体科技有限公司 growing? . A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

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Business Registration

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Operating Status: 开业
Registered Capital: 6,500万(元)
Legal Representative: 吴涛
Date Established:
Credit Code: 91320594MACMD3CB4Q
Registered Address: 中国(江苏)自由贸易试验区苏州片区苏州工业园区启明路8号综合保税区B区H厂房

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