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hiring requirements (9 open positions)

hiring over the years: 2026: 18 fewer positions than in 2025
* Hiring volume was generally low in 2020-2022 due to the pandemic

How is the salary at ? (39 records)

Salary range at : 4.5K - 15K, where 89.8% of positions earn ¥6-10K
salary over the years
Disclaimer: statistics are based on job posting analysis and do not represent the actual situation of current employees; system stability may affect objectivity, so please treat the data as reference only.Data inaccurate? Report it

Education requirement: 大专 is the most common

What education does 顶合半导体(武汉)有限公司 require? 大专占比最多,占55.3%,本科占18.4%,高中(含中专,中技)占13.2%,不限占13.2%

Salary by education

Note: 顶合半导体(武汉)有限公司 salaries by education, 大专 ¥7.4K, to see salaries for other education levels, click the detail page

Experience requirement: 不限 is the most common

Does 顶合半导体(武汉)有限公司 require much experience? 不限 accounts for 86.8% (the largest share), 3-5年 accounts for 7.9%, 1-3年 accounts for 5.3%

Salary by experience

Note: 顶合半导体(武汉)有限公司 salaries by experience, 1-3年 ¥8.0K, 3-5年 ¥9.5K, 不限 ¥7.5K

staff structure: 工厂生产类 is the most common

Which departments does 顶合半导体(武汉)有限公司 have? 工厂生产类 is the most common, accounting for 36.8%, 技工类 accounts for 15.8%, 电气/能源/动力类 accounts for 15.8%, 质量管理类 accounts for 15.8%, 经营管理类. Based on job postings in the past year. For reference only.

Salaries for hot jobs of

Are salaries high at 顶合半导体(武汉)有限公司? We provide: 自动化, 仓库, 操作员, 销售, 测试工程, 生产技术, 研发工程师, 库管. Click to view detailed salary analysis by job.

How is the growth outlook for the company?

Regional distribution of positions over the years

Employment outlook for 顶合半导体(武汉)有限公司: in 2026, 顶合半导体(武汉)有限公司 had openings in 1 regions , on par with 2025

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