[Summary] 半导体热管理研发、制造企业
近年来,Chiplet芯片设计模式兴起,SiP、2.5D/3D封装等先进封装技术持续迭代。导致芯片封装体内总功率不断上升,并且呈现典型的三维非稳态温度场,由此引发热应力损毁芯片的风险骤增。数年前,Intel等就提出了基于均温板(VC)的封装盖板研发诉求,但传统VC制程采用高温工艺路线,制造出的VCLid无法达到芯片封装的工艺要求。仲德科技以自研电化学增材制造技术——“原子堆垛毛细结构”技术为核心,开发出一条全新工艺路线,开发出的VCLid满足芯片封装的工艺要求。
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