Company Overview

Development Stage

  • Stage: A+轮, 数千万人民币。

About the Company

[Summary] 半导体热管理研发、制造企业

近年来,Chiplet芯片设计模式兴起,SiP、2.5D/3D封装等先进封装技术持续迭代。导致芯片封装体内总功率不断上升,并且呈现典型的三维非稳态温度场,由此引发热应力损毁芯片的风险骤增。数年前,Intel等就提出了基于均温板(VC)的封装盖板研发诉求,但传统VC制程采用高温工艺路线,制造出的VCLid无法达到芯片封装的工艺要求。仲德科技以自研电化学增材制造技术——“原子堆垛毛细结构”技术为核心,开发出一条全新工艺路线,开发出的VCLid满足芯片封装的工艺要求。

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仲德科技 Financing History (3 rounds)

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A+轮
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 数千万人民币
  • Investor: 创维集团,元禾原点,水木梧...

仲德科技 Related Industry Tags

Business Registration

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Operating Status: 开业
Registered Capital: 326.3397万(元)
Legal Representative: 周韦
Date Established:
Credit Code: 91442000MA55GEG834
Registered Address: 中山市火炬开发区中山港社区祥兴路6号数贸大厦南冀16层1604卡(住所申报)

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