固为晶准科技（广东）有限公司整合新加坡与中国的高精度半导体装备人才和市场，专注半导体集成电路领域光、电半导体芯片产业的微系统封装核心工艺装备技术的研发、技改、组装、销售、租赁等业务，核心工艺装备包括“多芯片贴装、特型引线键合、高可靠性气密包封”等类型。公司拥有近2000平米的开放式办公场所及产品装备调试间，核心技术团队由国内、外多名具有15～30年资深行业经验的骨干成员，以及拥有博士、硕士、学士学历的青年技术人才组成的。我们将充分发挥自身优势，秉承“科技领先，至臻至善”的宗旨和“以人为本”的企业理念不断进行技术创新、产品创新，持续不断的推出满足半导体集成电路未来发展的新型工艺装备。
What does 固为晶准科技（广东）有限公司 require? Who is 固为晶准科技（广东）有限公司 hiring? recruitment: 其他（研发和技术类）占比最多占47.1%，其次是机械/仪器仪表类占35.3%. What education can get in at ? 本科占比最多占82.4%，其次是硕士占17.6%. High education required at ? 硕士占17.6%. Work experience required at ? 3-5年占比最多占47.1%，其次是不限占29.4%. Where are the job locations at ? 石家庄占比最多占76.5%，其次是珠海占23.5%. Based on job postings from the past year, for reference only.
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