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Company Overview

Development Stage

About the Company

江苏通用半导体有限公司(以下简称通用半导体)是家国际化智能装备制造企业,致力于高端半导体产业装备及材料的研发与制造。公司核心团队由机械、光学、电气、材料和工艺等资深技术专家组建而成,是一支拥有研发设计、生产制造、运营管理等全阵容团队。
通用半导体成立于2019年,并于当年一举推出具备自主知识产权,国际先进的隐形激光晶圆切割设备,打破国际巨头的垄断,填补国内空白。通用半导体在激光微纳加工领域继续深耕,陆续推出了Low-K开槽设备、SDBG激光隐切设备、sic晶锭剥离整线设备和SDTT切割设备,获得了客户的认可及一致好评。
通用半导体未来将以半导体为基础,坚持以客户为中心持续创新,推动产业进步。

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Information is aggregated from the web and may not be exact. For reference only.
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Financing History (1 rounds)

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B轮
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 数亿人民币
  • Investor: 高信资本,九州一轨

Recruitment Overview / Current Status (30 open positions)

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Note: How fast is hiring at 江苏通用半导体有限公司 growing? 2026年28个,2025年9个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

Master's Degree Job Demand Analysis

(More)
+50%
Growth Rate
2026 vs 2025
Master's Hiring by Year: 2026 — 1 more jobs than 2025
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 江苏通用半导体有限公司 growing? 历年硕士招聘职位量:2026年3个,2025年2个. 江苏通用半导体有限公司在无锡硕士人才需求中排名第126, 江苏通用半导体有限公司硕士工资大部分在15-30K.

— What Are the Salaries Like? (30 records)

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salary range: 6K - 50K, 66.7% of roles pay ¥15-30K
Note: salary statistics are based on 30 salary records from the past year and depend on the job sample. For reference only.
江苏通用半导体有限公司工资待遇怎么样?66.7%的岗位拿15-30K,本科工资¥。无锡地区工资排名前50%,与同行业比+27%,计算机/网络/技术类平均工资¥23.9K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

(More)
Are salaries high at 江苏通用半导体有限公司? We provide: 工艺工程,软件工程,售后,机械工,视觉工程师,c#,pm,qe,ui,ux,仓库,仿真工程师,体系工程师,厂务,品质工程,学工,应用工程师,开发工程师,技术经理,抛光. Click to view detailed salary analysis by job.

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Job Category

  • 计算机/网络/技术类
    23.3% of total 23.3%
  • 工厂生产类
    20% of total 20%
  • 技工类
    20% of total 20%
  • 电子/电器/通信技术类
    13.3% of total 13.3%

Education

  • 本科
    76.7% of total 76.7%
  • 大专
    13.3% of total 13.3%
  • 硕士
    10% of total 10%

Experience

  • 3-5年
    56.7% of total 56.7%
  • 1-3年
    23.3% of total 23.3%
  • 5-10年
    16.7% of total 16.7%
  • 不限
    3.3% of total 3.3%
View Detailed Analysis

What does 江苏通用半导体有限公司 require? Who is 江苏通用半导体有限公司 hiring? 招聘类别计算机/网络/技术类占比最多占23.3%,其次是工厂生产类占20%。什么学历能进?本科占比最多占76.7%,其次是大专占13.3%。学历要求高吗?硕士占10%。工作经验有什么要求?3-5年占比最多占56.7%,其次是1-3年占23.3%。工作地区在哪?无锡占比最多占100%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 14,058万(元)
Legal Representative: 陶为银
Date Established:
Credit Code: 91410100MA47NM7M05
Registered Address: 江阴市青阳镇青桐路215号霞客湾创智园3幢1-2层

Partners & Suppliers

采购江苏通用半导体的划片机等封装设备 Source
合作客户 半导体封装测试设备
采购江苏通用半导体的贴片机等封装设备 Source
合作客户 半导体封装测试设备
采购江苏通用半导体的全自动晶圆划片机等封装设备 Source
合作客户 半导体封装测试设备

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