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Company Overview

About the Company

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Recruitment Overview / Current Status (1 open positions)

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Note: How fast is hiring at 合美半导体(苏州)有限公司 growing? . A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

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Business Registration

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Operating Status: 开业
Registered Capital: 1,000万(元)
Legal Representative: 王彬
Date Established:
Credit Code: 91320505MAE5Y20LXX
Registered Address: 苏州市高新区科技城科灵路78号12号楼103(1)、103(2)

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