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Development Stage

About the Company

苏州禾芯半导体有限公司成立于2023年8月,完成近亿融资,是初创集成电路设计企业。公司专注于企业、工业和车载Switch芯片设计及相关应用,通过自主研发的芯片方案,满足客户在设备互连、工业自动化与控制、网络监控以及车载ADAS、BDC、IVI等系统通信方面的应用需求。 公司核心团队由业界知名芯片设计专家组成,具有丰富的研发经验。目前已获得苏州工业园区科技*,并将获得姑苏创新创业*荣誉。 公司提供的Switch芯片解决方案旨在为国内企业提供高性能、高可靠性的Switch芯片,满足智能制造、汽车制造、工业生产以及企业园区等行业的通信需求。尤其,为AI趋势下的未来工业4.0、AIoT2.0和汽车自动驾驶等领域提供高效、安全和可靠的数据传输基础。

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Operating Status: 开业
Registered Capital: 542.8573万(元)
Legal Representative: 丁洁
Date Established:
Credit Code: 91320594MACR26X274
Registered Address: 中国(江苏)自由贸易试验区苏州片区苏州工业园区扬富路11号南岸新地一期商务楼栋5号楼705室

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Competitors (Similar Companies)

存储芯片 数据存储 计算芯片 超融合
电子厂/电子 集成电路设计 集成电路/IC 微电子
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