Company Overview

Development Stage

About the Company

企业专注于为芯片、LED等电子元器件实现SMT生产提供优质封装材料,凭借专
业技术团队和严格质控体系,保证产品质量,同时可提供定制化方案满足各类芯
片特殊需求,为客户提供至诚服务。
产品丰富,包含PC、ABS、PS载带皮料、高性能吸塑片材、保护带等多种材料。
凭借产学研一体化的发展模式,努力成为推动半导体封装材料行业技术进步的重
要力量,为客户提供优质的产品和服务。

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Business Registration

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Operating Status: 开业
Registered Capital: 2,000万(元)
Legal Representative: 张丽
Date Established:
Credit Code: 91330106MAC5PD8H5Q
Registered Address: 浙江省金华市浦江县仙华街道平七路848号(自主申报)

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