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我公司是一家专业从事电子产品来料加工的中小企业.为适应客户的市场需求,成立SMT部门,组建集BGA植珠,SMT,DIP加工,测试组装于一体的专业化工厂!并为各开发研发公司提供样板打样加工。周期短!业务范围包括: 电子产品的来料加工、OEM加工、SMT加工、SMT代工、插件、焊接、组装、测试、钢网制作、研发样板全板手工焊接、电脑主板及板卡、数码相机、MP3、摄像头、电表模块、DVD解码板、交换机、通信网络产品、光电产品等(封装包括:LGA、CSP、BGA、 QFP、TQFP、QFN、PLCC、SOT、SOIC、1206~0201等)以及各种连接器的压接。公司自成立以来,坚持以人为本的管理原则,注重员工的技术培训,现已有一批素质好、责任心强、技术精干的员工队伍,为确保产品质量提供了可靠的保证(依据IPC-A-610C CLASS Ⅱ 及公司标准),加工产品一次交验合格率达到了99%以上。一流的制造技术与服务,可为您的高难度、高密度(QFP、BGA、CSP、0201chip)的新品(包括军品)研制、试制及小批量生产提供加工服务。公司方针:强化过程因素控制,做专做精做强.公司文化:因为我们兢业,所以我们更专业。经营理验: 以丰富的经验和高端的科技为依托,以优质的服务为宗旨,无论是售前、售中或售后,都竭力让广大客户满意,以优质的产品为广大顾客提供品质保证。

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Recruitment Overview / Current Status (1 open positions)

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Operating Status: 开业
Registered Capital: 50万(元)
Legal Representative: 田建
Date Established:
Credit Code: 91510104672185749K
Registered Address: 成都市锦江区红星路一段9号1幢

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