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Company Overview

About the Company

东莞晶广半导体有限公司成立于2005年8月,于2006年进驻东莞市松山湖科技产业园区。公司主要从事先进的半导体集成电路测试和封装,以及新工艺开发。通过引进*的自动测试、封装和品管设备,晶广半导体为客户提供优质、高效、绿色的服务,包括晶圆探针测试、磨片、切割、封装、终测及品管检定等,并力求在制程能力及工艺开发的技术水平方面不断优化和创新,以持续向客户提供*优质的产品和服务,确保客户完全满意。免责声明内容如下:

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Business Registration

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Operating Status: 开业
Registered Capital: 750万(美元)
Legal Representative: 胡春
Date Established:
Credit Code: 91441900779204153M
Registered Address: 东莞市松山湖科技产业园区北部工业城B区厂房

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