苏州工业园区高联科技有限公司 Reviews

Company Overview

Nature: 民营公司 Founded: 22年
Industry: 机械/设备/重工
Full name: 苏州工业园区高联科技有限公司。

About the Company

高联科技始创于2004年，为半导体工业提供技术支持和后道封装测试设备。为半导体工业、电子工业和尖端高科技工业设计和制作高精度的夹具。

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Company / Job Addresses

苏州工业园区金鸡湖路173号科技中心312 

Nearby Companies

师惠湖西贵都双湖东环

Business Registration

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Operating Status: 开业

Registered Capital: 500万(元)

Legal Representative: 许加杰

Date Established:

Credit Code: 91320594757327451W

Registered Address: 苏州工业园区唐庄路288号2栋1号东侧厂房

Talent Demand Trend Analysis More

测试设备 +30%

夹具 +2%

工业电子 +15%

工装夹具 +12%

机床夹具 +2%

通用夹具 +2%

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Discover Great Companies, Discover Great Clients

苏州公司排名  苏州“工业园区”公司排名  苏州“测试设备”公司排名  苏州“夹具”公司排名  苏州“工业电子”公司排名  苏州“工装夹具”公司排名  苏州“机床夹具”公司排名  师惠附近的公司 

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苏州工业园区高联科技有限公司