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Research, development, production and sales of printed circuit boards

No.27 Shenzhen Popularity Ranking No.7 Bao'an District No.47 Guangdong No.1 线路板材料 No.2 线路板 No.2 电路板 No.3 基板 No.1 柔性电路板 No.2 电子电路 No.1 FPC No.3 光通信模块 No.6 硬件 No.1 柔性印刷电路板 No.1 柔性印刷电路板材料 No.1 电子新材料 副理事长单位 副会长单位 会长单位 理事长单位 国家高新技术企业 高新技术企业

Jingwang Electronics funding history / development milestones

IPO上市,

2026.09.01,

定向增发,融资金额未公开

2019.09.01, 兴业证券

定向增发,融资金额未公开

2018.09.01, 浦银国际

定向增发,融资金额未公开

2017.06.01, 光大银行

IPO上市,主板

2017.01.06,上交所

IPO上市,

2017.01.01,

Note: collected from public online reports, for reference only.

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