我司位于南山科技园,专业SMT样板贴片、PCB样品焊接、电路板焊接、研发手板焊接、小批量贴片试产,BGA焊接、BGA植球返修、OEM、代料加工、等服务。加工的器件封装 有:LGA、CSP、BGA、 QFP、TQFP、QFN、PLCC、SOT、SOIC、0805、0603、0402、0201等。
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