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About the Company

[Summary] 氮化镓外延材料制造商

晶湛半导体由业界公认的硅基氮化镓(GaN-on-Si)外延技术的开拓者程凯博士于2012年3月回国创办,坐落于苏州市工业园区,拥有国际先进的氮化镓外延材料研发和产业化基地,致力于为电力电子以及微显示等领域提供高品质氮化镓外延材料解决方案,也是目前国际上可供应300mm硅基氮化镓外延产品的先锋厂商,技术实力处于国际*地位。

在公司发展过程中,晶湛在业内创造过多项创举。2014年底,晶湛半导体率先在全球发布商用8英寸硅基氮化镓外延片产品,经有关下游客户验证,该材料具备*的技术指标和卓越的性能,实现了国内氮化镓产业的重要升级。2021年9月,晶湛半导体成功发布12英寸硅基电力电子氮化镓外延片,赢得了国内外广泛关注。经过多年的专注发展,晶湛半导体已经成为国内GaN材料研发和产业化的*企业,通过与全球数百家知名半导体科技企业、高校科研院所客户建立广泛深入的合作,多次在行业顶级期刊Nature Electronics,IEEE Electron DeviceLetters,及国际顶级会议IEDM等发布相关创新成果,引起国际半导体界的广泛关注和一致好评。

晶湛半导体高度重视自主研发和核心知识产权工作,在氮化镓外延领域已掌握多项核心技术, 拥有独立的自主知识产权,晶湛半导体目前已在国内外累计申请超900项专利,其中已获得超200项专利授权。公司还先后荣获苏州市技术发明一等奖、苏州工业园区专利授权十佳企业、苏州工业园区知识产权高质量创造奖、江苏省百件优质发明专利、江苏省高质量发明专利、苏州市优秀专利奖、国家高新技术企业、苏州市独角兽培育企业、苏州市企业工程技术研究中心等一系列资质和荣誉。

苏州晶湛半导体有限公司将一直秉承着“成为*的第三代半导体材料供应商”的愿景,为客户创造价值。

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晶湛半导体 Financing History (7 rounds)

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C+轮
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 数亿人民币
  • Investor: 尚颀资本,蔚来资本,新尚资...

晶湛半导体 How Fast Is Hiring Growing? (37 open positions)

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?
Growth Rate
2026 vs 2025
  • 2025: Up 100%
  • 2024: Up 50%
  • 2023: Up 4%
  • 2022: Down 61%
晶湛半导体 Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
晶湛半导体 Campus Recruitment & Advanced Degree Talent Demand
Part-time 1 Master's 1 Doctorate 1
Note: How fast is hiring at 苏州晶湛半导体有限公司 growing? 晶湛半导体2026: 54 openings (down 36%), 2025: 84 openings (up 100%), 2024: 42 openings (up 50%), 2023: 28 openings (up 4%), 2022: 27 openings (down 61%), 2021: 69 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

晶湛半导体 Master's Degree Job Demand Analysis

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?
Growth Rate
2026 vs 2025
  • 2025: Up 267%
  • 2024: Down 25%
  • 2023: Up 100%
  • 2022: Up 100%
晶湛半导体 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 苏州晶湛半导体有限公司 growing? 晶湛半导体Master's recruitment over the years: 2025: 11 openings (up 267%), 2024: 3 openings (down 25%), 2023: 4 openings (up 100%), 2022: 2 openings (up 100%), 2021: 1 openings.

晶湛半导体 Doctoral Degree Job Demand Analysis

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-50%
Growth Rate
2026 vs 2025
  • 2025: Down 33%
  • 2024: Flat 0%-
  • 2023: Flat 0%-
晶湛半导体 Doctoral Hiring by Year: 2026 — 1 fewer jobs than 2025
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is doctoral hiring at 苏州晶湛半导体有限公司 growing? 晶湛半导体Doctorate recruitment over the years: 2026: 1 openings (down 50%), 2025: 2 openings (down 33%), 2024: 3 openings (flat), 2023: 3 openings (flat), 2022: 3 openings.

晶湛半导体 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 苏州晶湛半导体有限公司? Based on an analysis of 晶湛半导体's job postings over the past year, "电子/电器/通信技术类" demand: 24.2%, "其他(研发和技术类)": 20.2%, "机械/仪器仪表类": 9.1%, "生物/制药/化工/环保类": 5.1%, "科研类": 1%. For reference only.

晶湛半导体 — What Are the Salaries Like? (99 records)

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salary range: 3K - 50K, 63.6% of roles pay ¥10-30K
Note: salary statistics are based on 99 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 苏州晶湛半导体有限公司?晶湛半导体63.6% of positions earn 10-30K, Fresh graduate salary: ¥7.0K。电子/电器/通信技术类 average salary ¥18.0K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 晶湛半导体

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Are salaries high at 苏州晶湛半导体有限公司? We provide: 法务,采购,设备工,研发工程师,cro,外延工程师,工艺工程,分析,审计,生产技术,销售,ie,pi,半导体技术,工艺技术,整合工程师,测试技术员,会计,出纳,设备主管. Click to view detailed salary analysis by job.

晶湛半导体 honors, qualifications & industry associations

晶湛半导体 Related Industry Tags

Job Category

  • 电子/电器/通信技术类
    23.8% of total 23.8%
  • 其他(研发和技术类)
    21.8% of total 21.8%
  • 工厂生产类
    18.8% of total 18.8%
  • 质量管理类
    18.8% of total 18.8%

Education

  • 本科
    73.3% of total 73.3%
  • 大专
    16.8% of total 16.8%
  • 硕士
    7.9% of total 7.9%
  • 博士
    1% of total 1%

Experience

  • 不限
    43.6% of total 43.6%
  • 1-3年
    21.8% of total 21.8%
  • 5-10年
    20.8% of total 20.8%
  • 3-5年
    12.9% of total 12.9%
View Detailed Analysis

What does 苏州晶湛半导体有限公司 require? Who is 晶湛半导体 hiring? 晶湛半导体 recruitment: 电子/电器/通信技术类占比最多占23.8%,其次是其他(研发和技术类)占21.8%. What education can get in at 晶湛半导体? 本科占比最多占73.3%,其次是大专占16.8%. High education required at 晶湛半导体? 硕士占7.9%,博士占1%. Work experience required at 晶湛半导体? 不限占比最多占43.6%,其次是1-3年占21.8%. Where are the job locations at 晶湛半导体? 苏州占比最多占98%,其次是无锡占2%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 8,212.5556万(元)
Legal Representative: 程凯
Date Established:
Credit Code: 91320594592520797R
Registered Address: 中国(江苏)自由贸易试验区苏州片区苏州工业园区旺家浜巷2号

Partners & Suppliers

供应氮化镓衬底 Source
合作客户 衬底材料
入驻苏州纳米城,租赁纳米科技公司提供的物业空间 Source
供应商 产业园区物业租赁
为江苏镓宏提供高质量的GaN外延片 Source
合作客户 外延片-供应商
提供氮化镓外延片,共建外延研发平台 Source
合作客户 外延材料
共建联合实验室,开展氮化镓外延技术研究 Source
供应商 高校/研究院合作

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晶湛半导体 Competitors (Similar Companies)

“Development and manufacturing of semiconductor materials, devices, and”
“是国际上为数不多的能够实现材料、工艺、器件整合的氮化镓电子器件公司”
“氮化镓外延片及器件”
“To become an internationally first-class integrated circuit manufactur”
连接器 生产 制造 汽车产业链
“光电器件及相关材料制造商”
半导体 芯片封装 半导体制造 图形处理器/GPU
“Providing highly competitive high-end equipment and high-quality servi”
半导体 光电 集成电路/IC 电力电子器件
“高性能功率半导体器件”
“专注于微型精密制造的国家高新技术企业”
“智能传感交互解决方案提供商”
“Provides integrated circuit wafer foundry and supporting services at 2”
半导体 微电子 传感器 集成电路/IC
“Empowering the information society with storage technology, improving ”

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